Aixun AX-SP138M Soldering Paste 50g

 The AiXun AX-SP183M 50 g tin solder pasteis a professional consumable for electronic microsoldering, PCB repair and BGA reballing. It is formulated with a metal alloy containing 63% tin and 37% lead, with a melting temperature of 183°C. Unlike conventional flux, this paste contains metal particles that melt to create electrical connections. It can be used for SMD soldering and forming new solder balls using BGA stencils, facilitating repair work on integrated circuits, chips and electronic components.

 • Brand:AiXun.

 • Model:AX-SP183M.

 • Product type:Metal solder paste containing tin for microsoldering and BGA reballing.

 • Alloy composition:63% tin (Sn) and 37% lead (Pb).

 • Melting temperature:183°C.

 • Contents:50 g.

 • Applications:SMD component soldering, PCB repair, integrated circuit microsoldering and BGA reballing.

 • Function:Provides the solder metal required to create electrical connections or form BGA solder balls through controlled heating.

 • Difference compared with flux:Contains metallic solder particles; it is not merely a flux.

 The AiXun AX-SP183Mallows technicians to work with a eutectic tin-lead alloy whose defined melting point of 183°C facilitates thermal control during soldering operations. Its paste consistency allows the material to be distributed over contact areas and BGA stencil openings, forming new metal solder balls when the appropriate heating process is applied. It is particularly useful in workshops specializing in mobile phone repairs, motherboards and electronic equipment requiring work on small components. It also enables SMD soldering without adding separate solder when the required amount is properly dispensed. Its 50 g format is practical for microsoldering tasks and professional electronic maintenance.

 • Preparation:Clean soldering surfaces and remove previous solder and flux residues before applying the product.

 • Application:Distribute a controlled amount of paste over the contacts or BGA stencil openings, avoiding excessive deposits and bridges between connections.

 • BGA reballing:Use a stencil compatible with the chip and apply an appropriate thermal profile to form the solder balls.

 • Temperature control:Bear in mind that 183°C is the melting temperature of the alloy, not necessarily the temperature that should be set on the soldering station.

 • Safety:Work with ventilation or local fume extraction, use ESD protection and avoid direct contact with the paste.

 • Inspection:Check the solder joints and the uniformity of the BGA balls after cooling, before proceeding with final assembly.

 This product contains lead (Pb). It is intended for soldering applications where the use of this alloy is permitted. It must not be used in processes requiring lead-free solder or compliance with restrictions applicable to this substance.