AiXun UP-100 10ml Halogen-Free Flux Paste

 The AiXun UP-100 10mlis a high-quality flux paste formulated without halogens or lead, designed to facilitate precision soldering, desoldering and microsoldering operations. Its composition promotes solder wetting and flow, helping achieve uniform solder joints during electronic circuit board repairs. It is particularly suitable for motherboard repairs on smartphones, tablets, computers and other electronic devices. It allows technicians to work on SMD components, integrated circuits and BGA connections, providing controlled application for professionals specializing in electronic repair and maintenance.

 - Brand:AiXun.

 - Model:UP-100 / AX-UP100.

 - Product type:Flux paste for electronic soldering and desoldering.

 - Volume:10 ml.

 - Formulation:Halogen-free and lead-free.

 - Product color:Milky white.

 - Applicator:Precision metal nozzle with a 1 mm outlet.

 - Packaging:High-barrier PVDC material, designed to protect the contents against moisture and oxidation during storage.

 - Properties:Good wetting performance, high activity, fluidity and low smoke generation.

 - Applications:Microsoldering, desoldering, PCB repair, SMT rework, BGA ball placement and electronic component soldering.

 - Common components:Charging connectors, SMD components, integrated circuits, chips, processors and motherboard connections.

 - Working tools:Precision soldering irons and hot air rework stations.

 AiXun UP-100 flux is developed to facilitate microsoldering operations requiring precision, application control and good solder wetting. Its halogen-free and lead-free formulation allows it to be used in electronic repair operations where consumables with these characteristics are preferred. The 1 mm metal nozzle enables localized dispensing onto connectors, terminals and small solder joints. Its low-smoke behavior and reduced residues support cleaner working conditions during repairs. The high-barrier PVDC packaging helps protect the product against environmental factors during storage. It is suitable for technicians performing connector replacements, integrated circuit repairs, BGA operations and electronic circuit board maintenance.

 - Disconnect the device power supply and battery before starting work and use ESD protection measures.

 - Clean the working surface to remove dirt, dust and residues that may interfere with soldering.

 - Apply a small amount of flux directly to the terminals, contacts or solder joints.

 - Use a precision soldering iron or hot air rework station at a temperature suitable for the component and solder alloy being used.

 - For BGA or SMT operations, distribute the flux locally to facilitate heating and wetting of the connections.

 - Avoid prolonged heating of tracks and components to reduce the risk of thermal damage.

 - Visually inspect the solder joints and clean any residues when required by the repair conditions.

 - Close the container properly after use and store it in a cool place, away from excessive heat.