MAX77775P power management ic by Samsung Galaxy S25 Edge 5G S25 FE 5G S25 5G S25 Plus S25 Ultra premium

MAX77775P power management IC for Samsung Galaxy S25 5G S931 / S25 Plus 5G S936 / S25 Ultra 5G S938 / S25 Edge 5G / S25 FE 5G premium quality

MAX77775P power management integrated circuit designed for motherboard repair of Samsung Galaxy S25 5G (SM-S931), Galaxy S25 Plus 5G (SM-S936), Galaxy S25 Ultra 5G (SM-S938), Galaxy S25 Edge 5G and Galaxy S25 FE 5G devices. This electronic component manages the internal power distribution of the smartphone, controlling the electrical supply for different subsystems such as the processor, memory, display, communication modules and charging circuits.

Replacing this IC is a common motherboard repair procedure when the device shows power related issues such as boot failure, random reboots, abnormal battery consumption or charging malfunction. The MAX77775P chip restores proper voltage regulation and internal power control, bringing electrical stability back to the device. This spare part is intended for technicians specialized in microsoldering and advanced motherboard repair.

Specifications

• Component type: PMIC power management IC
• Chip model: MAX77775P
• Function: system power management and voltage regulation
• Installation: direct soldering on motherboard (BGA / microsoldering)
• Compatibility: Samsung Galaxy S25 5G, S25 Plus 5G, S25 Ultra 5G, S25 Edge 5G, S25 FE 5G
• Use: motherboard power circuit repair

Premium quality ensures stable operation and proper electrical tolerances for professional motherboard repair. This type of spare part is commonly used by specialized repair centers to restore devices affected by power management failures, random restarts or charging problems related to the internal power management circuit.

Designed for professional microsoldering work in repair labs and technical workshops, allowing technicians to restore the device functionality when the power management IC becomes damaged.

Installation tips

Disconnect the battery and discharge capacitors before working on the motherboard.

Use a proper hot air station or microsoldering equipment for BGA components.

Protect nearby components with thermal tape or appropriate heat shielding.

Ensure correct chip alignment before performing the final soldering.

Check continuity and absence of short circuits after installation.

Technical table