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Noctua NT-H1 Thermal paste
48211
New
This product is no longer in stock
Volume discounts
| Quantity | Total amount | Price 1 unit |
|---|---|---|
| 5 | €69.15 | Price €13.83 |
buy Noctua NT-H1 Thermal paste
NT-H1 is a top-of-the-line thermal interface material for enthusiasts who demand exceptional performance with maximum ease of use: a hybrid composite of different microparticles that allows for minimal thermal resistance, excellent ease of use and remarkable long-term stability.excellent performance NT-H1 consists of a thermal compound of different microparticles, optimized for use in PCs. Thanks to its extremely low thermal resistance, as well as excellent flexibility and ease of spreading, NT-H1 obtains very remarkable results. Maximum ease of use and efficient dosing Since NT-H1 spreads very well under pressure, it is not necessary to apply the paste on the heatsink. This reduces, on the one hand, product consumption; on the other, the time spent in the installation process. Put a drop of NT-H1 in the center of your CPU, install the heatsink and you're done! Optimum performance from the start NT-H1 reaches its maximum performance from the beginning and does not need a warm-up time. Excellent long-term stability NT-H1 does not contain solvents or other substances with a low flash point and provides great long-term stability. Due to its exceptional curing, purging and drying and thermal cycling characteristics of the compound, NT-H1 can be used for several years without problem. Non-conductive, non-corrosive NT-H1 has a very low dielectric constant and high dielectric strength. Consequently, there is no danger of short circuits even in case of direct contact with conductive components or PATHS. Fully compatible with all materials commonly used in PCs, this thermal paste is suitable for use on copper and aluminum heatsinks. Suitable for compression refrigeration NT-H1 is perfect for use in compression coolers. Even at very low temperatures, the paste provides full performance and remains easy to clean.
NT-H1 is a top-of-the-line thermal interface material for enthusiasts who demand exceptional performance with maximum ease of use: a hybrid composite of different microparticles that allows for minimal thermal resistance, excellent ease of use and remarkable long-term stability.excellent performance NT-H1 consists of a thermal compound of different microparticles, optimized for use in PCs. Thanks to its extremely low thermal resistance, as well as excellent flexibility and ease of spreading, NT-H1 obtains very remarkable results. Maximum ease of use and efficient dosing Since NT-H1 spreads very well under pressure, it is not necessary to apply the paste on the heatsink. This reduces, on the one hand, product consumption; on the other, the time spent in the installation process. Put a drop of NT-H1 in the center of your CPU, install the heatsink and you're done! Optimum performance from the start NT-H1 reaches its maximum performance from the beginning and does not need a warm-up time. Excellent long-term stability NT-H1 does not contain solvents or other substances with a low flash point and provides great long-term stability. Due to its exceptional curing, purging and drying and thermal cycling characteristics of the compound, NT-H1 can be used for several years without problem. Non-conductive, non-corrosive NT-H1 has a very low dielectric constant and high dielectric strength. Consequently, there is no danger of short circuits even in case of direct contact with conductive components or PATHS. Fully compatible with all materials commonly used in PCs, this thermal paste is suitable for use on copper and aluminum heatsinks. Suitable for compression refrigeration NT-H1 is perfect for use in compression coolers. Even at very low temperatures, the paste provides full performance and remains easy to clean.
