XZZ 138° Lead-Free Low Temperature Solder Paste 50g

XZZ 138°C low temperature solder paste, supplied in a 50-gram container, is a lead-free technical consumable designed for microsoldering, electronic repairs and SMD and BGA component rework. Its melting point of 138°C allows solder joints to be formed using lower temperatures than those typically required for many conventional alloys. It is intended for assembly, repair and maintenance operations on printed circuit boards (PCBs). Its paste format facilitates controlled material application using precision tools and soldering stencils.

- Brand: XZZ (Xinzhizao).

- Product: Lead-free low temperature solder paste.

- Melting point: 138°C.

- Net weight: 50g.

- Composition: Lead-free solder alloy.

- Format: Solder paste for electronic applications.

- Soldering technology: SMD, SMT and BGA.

- Applications: Microsoldering, reballing, electronic rework and PCB repair.

- Application method: Manual dispensing using precision tools or soldering stencils.

- Compatible equipment: Hot air stations and temperature-controlled reflow equipment.

- Professional use: Repair and maintenance of electronic circuit boards and surface-mount components.

XZZ low temperature solder paste features a melting point of 138°C, allowing technicians to work with lower thermal profiles than those used with conventional higher-temperature solders. This characteristic is useful in electronic repair operations requiring controlled heat exposure during the soldering process.

Its lead-free formulation provides an alternative for applications using this type of alloy. The paste format facilitates dispensing and distributing material onto contacts, terminals and reballing stencils, allowing targeted applications.

The 50-gram container provides a practical quantity for routine workshop tasks, including component assembly and electronic circuit rework. It is a suitable consumable for professionals specializing in microsoldering and motherboard repair.

- Disconnect the power supply from the electronic board and use ESD protection before starting work.

- Clean the contacts and soldering surfaces to remove deteriorated solder, dirt and previous residue.

- Prepare the application tools and select a suitable stencil when performing reballing work.

- Gently homogenize the paste before use when necessary.

- Apply a controlled amount of product to the soldering areas, distributing it evenly.

- Position the components according to the alignment of their terminals with the board contacts.

- Use a hot air station or reflow equipment with a thermal profile suitable for solder paste with a melting point of 138°C.

- Apply progressive and uniform heating to promote solder joint formation.

- Allow the components to cool in a controlled manner before handling them.

- Inspect the connections using a microscope to check contact alignment and detect possible solder bridges.

- Clean process residue where applicable and perform the necessary electrical and functional tests.

- Keep the container properly closed and store the product according to the manufacturer's recommended storage conditions.