Mechanic XG-50 Medium-Temperature Solder Paste

Mechanic XG-50 medium temperature solder paste is a consumable for microsoldering, electronic circuit board repair and SMD and BGA component assembly. Its Sn63/Pb37 alloy, consisting of 63% tin and 37% lead, has a melting point of 183°C. The product combines fine metal particles with incorporated flux for application to contacts and soldering stencils. It is suitable for reballing, integrated circuit rework and restoring connections on circuit boards in mobile phones, tablets and other electronic equipment.

- Brand: Mechanic.

- Model: XG-50.

- Component: Medium temperature solder paste.

- Alloy: Sn63/Pb37.

- Composition: 63% tin (Sn) and 37% lead (Pb).

- Melting point: 183°C.

- Particle size: 25-45 µm.

- Flux type: Flux incorporated into the paste.

- Soldering technology: SMT, SMD and BGA.

- Applications: Integrated circuit reballing, SMD component soldering and PCB repair.

- Application method: Manual dispensing or soldering stencils.

- Working equipment: Hot air stations and reflow equipment.

- Recommended storage temperature: 0-10°C.

- Use: Electronic repairs, microsoldering and motherboard maintenance.

The eutectic Sn63/Pb37 formulation of Mechanic XG-50 melts at 183°C, making it easier to define working profiles for components and boards that use leaded solder. The particle size of 25 to 45 µm supports controlled application on small contact surfaces and material distribution using reballing stencils.

The incorporated flux facilitates surface wetting during solder joint formation. Its consistency allows the paste to be deposited on soldering points before heating, a useful characteristic for SMD component assembly and BGA integrated circuit rework.

It is a suitable consumable for workshops specializing in microsoldering, mobile phone repair and electronic circuit board maintenance that require precise application of soldering material.

- Disconnect the power supply from the electronic board and use ESD protection before starting work.

- Allow the paste to gradually reach room temperature before opening the container if it has been refrigerated.

- Clean the contacts and soldering surfaces to remove deteriorated solder and previous residue.

- Select a reballing stencil suitable for the component's contact dimensions and layout.

- Apply a controlled amount of paste and distribute it evenly across the soldering areas.

- Position the components according to the alignment of their terminals with the board contacts.

- Use a hot air station or reflow equipment with a thermal profile suitable for the Sn63/Pb37 alloy and its melting point of 183°C.

- Apply progressive and uniform heating to promote solder joint formation.

- Allow the components to cool before handling them.

- Inspect the connections using a microscope to check alignment and detect possible solder bridges.

- Clean flux residue when necessary and perform the corresponding electrical and functional tests.

- Keep the container properly closed and store it refrigerated between 0 and 10°C when not in use.